Senior Packaging Engineer
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Senior Packaging Engineer

Reference: zb18
Location
United Kingdom
Salary
£55k-65k
Contract Type
Permanent
Work Arrangement
Hybrid
Skill Requirements
  • Embedded, Electronics & Semiconductors

A global semiconductor company is looking for a Senior Packaging Engineer to own the technical development of medium-to-high performance semiconductor packaging solutions. This is a 0-1 role encompassing client relationships, R&D, design and production.

 

What's in it for you

  • Utilise your creativity across a range of different industries spanning aerospace, medical, automotive and more. Every project brings its own challenges and opportunities
  • Liaise with clients across the globe to understand their unique requirements and find innovative engineering solutions to match their needs
  • Shape and drive projects from the beginning to end of the packaging lifecycle
  • Work within a passionate and open environment, where every new idea is valued

 

Key responsibilities

  • Evaluate and select appropriate package technologies to support product requirements.
  • Support packaging technology development with suppliers and manufacturing partners.
  • Design semiconductor packages including wirebond, flip-chip, embedded, and advanced package solutions.
  • Optimise package performance for size, electrical characteristics, and thermal efficiency.
  • Improve design tools, processes, and development methodologies.
  • Maintain awareness of industry developments and emerging packaging technologies.
  • Support testing teams and customers with package documentation, thermal models, and technical guidance.
  • Review and report package assembly and manufacturing data.

 

Core Requirements

  • Master’s degree or higher in Engineering, Electronics, Physics, Materials Science, or related field.
  • Strong experience with semiconductor packaging and assembly processes.
  • Familiarity with package types such as DFN, QFN, BGA, SiP, and WLCSP.
  • Experience using 3D CAD design tools such as AutoCAD or similar.
  • Good understanding of semiconductor package thermal analysis and characterization.
  • Confidence presenting technical information to stakeholders and partners.

 

If this is interesting to you, click 'Apply' today. Be quick, as interviews are already being scheduled!

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Zak Bowyer
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